| 1. | Specification of leadframes for plastic leaded chip carrier packages
塑料有引线片式载体封装引线框架规范 |
| 2. | Electronic components . chip carrier
电子元件.芯片载体 |
| 3. | Plcc plastic leaded chip carriers
塑料行间芯片运载 |
| 4. | Sectional specification for sockets for chip carriers for use in electronic equipment
电子设备用芯片载体插座分规范 |
| 5. | Chip carrier sockets for plastic quad flat packages for use in electronic equipment , blank detail specification for
电子设备用塑料方形扁平封装用片式载体插座的空白详细规范 |
| 6. | Detail specification for burn - in sockets for chip carrier packages with molded carrier rings for use with electronic equipment
电子设备用带模压载体环的片式载体封装烧进插座的详细规范 |
| 7. | Chip carrier sockets for leadless type a , b , d chip carriers for use in electronic equipment , blank detail specification for
电子设备用无引线a b和d型片式载体用片式载体插座的空白详细规范 |
| 8. | Printed boards and assemblies - design and use - attachment land joint considerations - chip carriers with j - leads on four sides
印制板和组件.设计和使用.附件条件.四面带有j形引线的片状载体 |
| 9. | Blank detail specification for burn - in socket for chip carrier packages with molded carrier rings for use in electronic equipment
电子设备用带模压载体环的片式载体封装烧进插座的空白详细规范 |
| 10. | . j printed boards and printed board assemblies - design and use - part 5 - 6 : attachment land joint considerations - chip carriers with j - leads on four sides
印制电路板和印制电路板组件.设计和使用.第5 - 6部分:附件 |
